• PYREX® Glass Wafer
  • 글라스 웨이퍼, PYREX

■ PYREX® Glass 재질
■ TTV (Total Thickness Variation) : ± 10㎕
■ Bow (± 30㎕), RA(15Å)
■ Double Side Polishing (DSP)
■ 특성 : 낮은 열팽창 (급열, 급냉에 깨지지 않음), 내열성, 내화학성 우수



* PYREX® Glass 재질
* Chemical Composition : SiO2(81%)+B2O3(13%)+Na2O/K2O (4%)+AI2O3(2%)
* Optical Properies : Refractive Index (587.6mm ~ 1.4714 nd)
* Application : Semiconductor engineering, electronics, sensors (Wafer, Display Glass)
* TTV (Total Thickness Variation) : ± 10㎕
* Bow (± 30㎕), RA (15Å)
* Double Side Polishing (DSP)
* 특성 : 낮은 열팽창 (급열, 급냉에 깨지지 않음), 내열성, 내화학성 우수
* 규격외 제품은 문의 바람
  •    
    Cat. No. Model Dia. Thickness Shape
    W04-171-412 GW04T05 4" 500±30 ㎛ as - cut
    W04-171-418 GW04T10 1000±30 ㎛
    W04-171-424 GW05T05 5" 500±30 ㎛
    W04-171-430 GW05T10 1000±30 ㎛
    W04-171-436 GW06T05 6" 500±30 ㎛
    W04-171-442 GW06T10 1000±30 ㎛
    W04-171-448 GW08T05 8" 500±30 ㎛
    W04-171-454 GW08T10 1000±30 ㎛
     
    Wavelength 435.8 nm 479.9 nm 546.4 nm 589.3 nm 643.8 nm
    Refraction 1.4801 n 1.4767 nf 1.4731 ne 1.4713 n 1.4695 nc